Effects of Minor Al, Ag, and Sb Additions on the Thermal, Microstructure and Microhardness of Zn–Sn–Cu–Bi High-Temperature Solder Alloys

Abstract

In the present study, the changes in microstructure, thermal conductivity (K), melting properties and microhardness (HV) adding of 0.05 wt % Al, Ag and Sb into Zn–5Sn–2Cu–1.5Bi (ZSCB) high temperature solder alloy were investigated. The addition of trace amounts of Al, Ag and Sb caused a significant improvement in K and HV values. Addition of 0.05 wt % of Al and Ag into the ZSCB alloy increased the K and HV values by 62% and in the range of 19–21%, respectively. The addition of 0.05 wt % of Sb increased the K and HV values by 32 and 36%, respectively.