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Effect of Minor Sb Additions on Thermal Properties, Microstructure and Microhardness of Sn–Ag–Cu High-Temperature Solder Alloys

Aksöz, Sezen; Öcal, Fadimana; Ata Esener, Pınar; Öztürk, Esra; Maraşlı, Necmettin (MAIK NAUKA/INTERPERIODICA/SPRINGER 233 SPRING ST, NEW YORK, NY 10013-1578, 2023)

In the present study, changes in thermal properties, microstructure and microhardness were investigated when 0.5, 1, 1.5 wt % Sb were added to Sn–1 wt % Ag–0.5 wt % Cu (SAC105) solder alloy system. The addition of Sb ...